April 6, 2025 - 04:47
A new technical paper titled “PPAC Driven Multi-die and Multi-technology Floorplanning” has emerged from collaborations between researchers at Texas A&M University and Duke University. This groundbreaking study addresses the complexities of heterogeneous integration, particularly in scenarios where various dies employ different technologies.
The authors emphasize that effective floorplanning across multiple dies necessitates a simultaneous selection of technologies, a challenge that has not been systematically explored until now. Traditional methods often fall short when it comes to accommodating the diverse requirements of multi-die systems, making this research particularly relevant in today’s rapidly evolving technological landscape.
By presenting a comprehensive analysis of the intricacies involved in multi-die and multi-technology floorplanning, the authors aim to enhance the efficiency and performance of integrated circuits. This study not only paves the way for future advancements in chip design but also underscores the importance of interdisciplinary collaboration in tackling complex engineering problems. The findings could significantly influence how future electronic systems are developed and optimized.
